Phenolic Laminates
Phenolic Laminates
ISO 9001 Certified A216926
ISO 9001 Certified A216926
Underwriters Laboratories
Underwriters Laboratories

Phenolic Resin Back-up Laminate SD-BU26:
Commonly known as Back-up board, Entry board, PCB drilling board

The main application for phenolic resin back-up boards is as the protective entry or back-up board while drilling or routing of flexible and/or rigid printed circuit boards (PCB).
Designations Characteristics & Applications Fabricating Suitability Minimum Diameter for Drilling (mm)
SD-BU26 For BGA drilling entry or back-up use,low percentage of warp and twist No smear or burr occurrence while drilling ≧0.15φ
Designations Standard Thickness (mm) Thickness Tolerance (mm) Standard Dimensions (mm)
SD-BU26 +1.5/-0.1 ±0.05 (S)942×1245
Typical Properties Test Method Condition(1) Unit Value
Resin - - - Phenolic Resin
Composition - - - Kraft Paper
Standard Colour - - - Brown
Specific Gravity JIS-K6911 - - 1.38~1.44
Heat Resistance 120 Minutes at 120 ℃ A - No Change
Flexural Strength (Crosswise) MD JIS-K6911 A Kgf/mm2 ≧13.0
CD ≧11.0
Water Absorption JIS-K6911 E-24/50+D-24/23 g/200cm2 ≦2.0
Percentage of Warp and Twist JIS-K6911 A % ≦0.9
Hardness, Shore D JIS-K7215 A ° 90±2
Storage - - 5~40
- RH % 50~80
※The heavy metal content of this product tested by the Environmental Affairs Department is in accordance with the National Standard. (Case Number: ET88D0181)

(1) The alphabet in condition indicates the kind of conditioning of specimen.
A: as received without conditioning.
C: conditioned in air under constant temperature and humidity.
D: immersed in water under constant temperature.
E: conditioned in air under constant temperature.
O: immersed in oil under constant temperature.

The first figure is the conditioning time(hours),the second figure is the conditioning temperature(℃) and the third figure is the conditioning relative humidity(%).